
Search results for 'emc gaskets':
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Manufacturers of RFI/EMI Shielding Gaskets & Components. Kemtron helps customers meet their RFI/EMI shielding and environmental sealing requirements with innovative RF solutions that enhance product performance, reduce through life costs and ensure regulatory conformance.


The 7300 series EMC-IP gaskets are cost-effective combinations of an EMI shielding gasket and a water seal. This type of gasket comes with a self-adhesive strip. The gasket consists of two neoprene foam cores, one of which is covered with reinforced foil, based on the high performance Amucor alloy.


In addition to EMC and ESD shielding, protection against environmental influences such as dust and moisture is often also required. This can be achieved by using so-called combi gaskets. Either of the following may be used for this purpose: separate seals for EMC and IP (Intrusion Protection) or ; combi gaskets
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HEMP EMC TEMPEST RFI EMP Shielded Doors; EMI/RFI Shielding gaskets - Enviromental IP 65 EMC/EMI Gaskets - EMKA gaskets clad in conductive fabric - EMI gaskets with conductive fabric over foam core - Twinshield Gaskets (EMI shielding+IP65) - Wire mesh over elastomer gaskets - EMI/EMC full metal gaskets. IP65 / EMI EMC IP 65 Sealed gaskets


EMC gaskets are available with combinations of properties to address virtually any application. Metal finger stock made from beryllium-copper (BeCu) or stainless steel (Figure 1) is a very effective, proven type of gasket but does not provide a seal against dust or moisture.Because each finger moves independently to make electrical contact, the effective gap length is very short, ensuring good ...


Full metal gaskets are used for shielding lockers and containers where there is no need for elastic recovery after crushing. These are ideal for EMI/EMP shielding. These are not suitable for applications also requiring a seal from atmospheric conditions or elements, like water.


A dispensed gasket is formed in placed on a metal or plastic cover, creating electromagnetic compatibility by deforming true compression between the cover and a PCB or other electrically conductive surfaces.